Modeling of thermal conductivity of reed products

Ескіз

Дата

2020

Автори

Tsapko, Yu.
Tsapko, A.
Bondarenkо, O.

Заголовок журналу

Журнал ISSN

ISSN журналу

1757-899X

Назва тому

Видавець

Анотація

The present work researches processes of heat transfer by samples of mats manufactured from reed. Due to the unique properties of the reed, such as medium density, low thermal conductivity, relatively high weather resistance, high chemical resistance, possibility to produce parts on-site, cost-effectiveness and others, reed products are widely used in building construction despite the high rate of development of new technologies. The mechanisms of heat insulation in the result of energy transfer through the material are established, which makes it possible to influence this process. It is proven, that the mechanisms are conditioned upon the increased porosity of the material. Thus, decreasing volume weight results in decreasing thermal conductivity, and vice versa. The simulation of the heat transfer process with the flameproof coating is carried out, the dependencies of the thermophysical coefficients on the temperature are determined. Based on the obtained dependencies, the coefficient of thermal conductivity for the products made of dry pine wood is calculated and makes 0.056 W / (m · K). Features of slowing down the process of heat transfer to material made of wood wool and glue binding agent with the formation of pores were studied. This is explained by the fact that there is no movement of air in large pores, accompanied by heat transfer. Thus, there are grounds to argue for the possibility of directed regulation of the processes of the formation of thermal insulation products using the reeds characterized by voids in the stems.

Опис

Ключові слова

reed, heat-insulating products, thermal conductivity, surface finishing, thermophysical properties

Кафедра авторів

кафедра будівельних матеріалів

Бібліографічний опис

Tsapko Yu. Modeling of thermal conductivity of reed products / Yu. Tsapko, A. Tsapko, O. Bondarenkо // IOP Conference Series : Materials Science and Engineering. - 2020. – Vol. 907. - P. 1 - 10. – Bibliogr. : 16 titl. doi:10.1088/1757-899X/907/1/012057. https://iopscience.iop.org/article/10.1088/1757-899X/907/1/012057

УДК

536.2:633.584.4

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