Modeling of thermal conductivity of reed products

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dc.contributor.authorTsapko, Yu.
dc.contributor.authorTsapko, A.
dc.contributor.authorBondarenkо, O.
dc.date.accessioned2020-11-10T14:16:32Z
dc.date.available2020-11-10T14:16:32Z
dc.date.issued2020
dc.description.abstractThe present work researches processes of heat transfer by samples of mats manufactured from reed. Due to the unique properties of the reed, such as medium density, low thermal conductivity, relatively high weather resistance, high chemical resistance, possibility to produce parts on-site, cost-effectiveness and others, reed products are widely used in building construction despite the high rate of development of new technologies. The mechanisms of heat insulation in the result of energy transfer through the material are established, which makes it possible to influence this process. It is proven, that the mechanisms are conditioned upon the increased porosity of the material. Thus, decreasing volume weight results in decreasing thermal conductivity, and vice versa. The simulation of the heat transfer process with the flameproof coating is carried out, the dependencies of the thermophysical coefficients on the temperature are determined. Based on the obtained dependencies, the coefficient of thermal conductivity for the products made of dry pine wood is calculated and makes 0.056 W / (m · K). Features of slowing down the process of heat transfer to material made of wood wool and glue binding agent with the formation of pores were studied. This is explained by the fact that there is no movement of air in large pores, accompanied by heat transfer. Thus, there are grounds to argue for the possibility of directed regulation of the processes of the formation of thermal insulation products using the reeds characterized by voids in the stems.uk_UA
dc.identifier.citationTsapko Yu. Modeling of thermal conductivity of reed products / Yu. Tsapko, A. Tsapko, O. Bondarenkо // IOP Conference Series : Materials Science and Engineering. - 2020. – Vol. 907. - P. 1 - 10. – Bibliogr. : 16 titl. doi:10.1088/1757-899X/907/1/012057. https://iopscience.iop.org/article/10.1088/1757-899X/907/1/012057uk_UA
dc.identifier.issn1757-899X
dc.identifier.urihttps://repositary.knuba.edu.ua/handle/987654321/6245
dc.language.isoenuk_UA
dc.subjectreeduk_UA
dc.subjectheat-insulating productsuk_UA
dc.subjectthermal conductivityuk_UA
dc.subjectsurface finishinguk_UA
dc.subjectthermophysical propertiesuk_UA
dc.subjectкафедра будівельних матеріалівuk_UA
dc.subject.udc536.2:633.584.4uk_UA
dc.titleModeling of thermal conductivity of reed productsuk_UA
dc.typeArticleuk_UA

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