Modeling of thermal conductivity of reed products
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Дата
2020
Автори
Tsapko, Yu.
Tsapko, A.
Bondarenkо, O.
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Анотація
The present work researches processes of heat transfer by samples of mats
manufactured from reed. Due to the unique properties of the reed, such as medium density, low
thermal conductivity, relatively high weather resistance, high chemical resistance, possibility to
produce parts on-site, cost-effectiveness and others, reed products are widely used in building
construction despite the high rate of development of new technologies. The mechanisms of heat
insulation in the result of energy transfer through the material are established, which makes it
possible to influence this process. It is proven, that the mechanisms are conditioned upon the
increased porosity of the material. Thus, decreasing volume weight results in decreasing thermal
conductivity, and vice versa. The simulation of the heat transfer process with the flameproof
coating is carried out, the dependencies of the thermophysical coefficients on the temperature
are determined. Based on the obtained dependencies, the coefficient of thermal conductivity for
the products made of dry pine wood is calculated and makes 0.056 W / (m · K). Features of
slowing down the process of heat transfer to material made of wood wool and glue binding agent
with the formation of pores were studied. This is explained by the fact that there is no movement
of air in large pores, accompanied by heat transfer. Thus, there are grounds to argue for the
possibility of directed regulation of the processes of the formation of thermal insulation products
using the reeds characterized by voids in the stems.
Опис
Ключові слова
reed, heat-insulating products, thermal conductivity, surface finishing, thermophysical properties, кафедра будівельних матеріалів
Бібліографічний опис
Tsapko Yu. Modeling of thermal conductivity of reed products / Yu. Tsapko, A. Tsapko, O. Bondarenkо // IOP Conference Series : Materials Science and Engineering. - 2020. – Vol. 907. - P. 1 - 10. – Bibliogr. : 16 titl.
doi:10.1088/1757-899X/907/1/012057. https://iopscience.iop.org/article/10.1088/1757-899X/907/1/012057